HongXin

How our products apply in different industries

Electronic Industry

In electronics, we provide high-precision parts and conductivity-enhancing treatments. They encompass connectors, heat-dissipating modules, and sensor housings. Through plating and micro-machining processes, they meet industry conductivity norms, elevating performance in advanced electronic systems.

Applications

Component Name

Specific Application Scenarios

Heat Sinks

CPU/GPU coolers, heat dissipation fins for 5G base station power amplifiers.

Precision Connectors

High-speed data interfaces (HDMI, USB-C), RF connectors.

Semiconductor Packages

IC carriers, LED brackets, requiring precise pin alignment.

Optical Components

Camera lens mounts, LiDAR mirror bases, demanding zero deformation.

Common Materials

Metals

Aluminum alloys
(6063, 6061)

copper alloys
(C1100, C17200 beryllium copper)

Ceramics

Aluminum oxide (Al₂O₃)

aluminum nitride (AlN)

Engineering plastics

POM (polyoxymethylene)

LCP (liquid crystal polymer)

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Tolerance Requirements

Micro-connectors

±0.003mm ~ ±0.01mm (pin pitch)

Heat sink fins

±0.02mm ~ ±0.05mm (thickness control)

Flatness

≤ 0.01mm/100mm² (ensuring thermal conductivity)