HongXin

Electronic Industry

In electronics, we provide high-precision parts and conductivity-enhancing treatments. They encompass connectors, heat-dissipating modules, and sensor housings. Through plating and micro-machining processes, they meet industry conductivity norms, elevating performance in advanced electronic systems.

Applications

Component Name

Specific Application Scenarios

Heat Sinks

CPU/GPU coolers, power module heat dissipation plates, etc

Enclosures & Chassis

Electronic device housings, server cases, sensor protection covers, etc

Connectors & Interfaces

High-frequency connectors, RF adapters, PCB socket housings, etc.

PCB Mounts & Brackets

Circuit board mounting brackets, insulating spacers, installation rails, etc.

RF/Microwave Components

Waveguide cavities, antenna bases, filter housings, etc.

Common Materials

Aluminum Alloys

Copper Alloys

Steel

engineering plastics

Titanium Alloy

Carbon Fiber

Tolerance Requirements

Critical Tolerances

Profile tolerance ≤ ±0.005mm,Hole position tolerance ≤ 0.10mm

Surface Requirements

Anodizing (aluminum), gold plating (connectors), etc,High precision, thermal conductivity, or electromagnetic shielding

Material Certification

AL6061、7075、5052/C11000、C36000、Aluminum or Phosphor bronze/304、303、316/Grade 5(Ti-6Al-4V)/PEEK、PA、PC、CFRP、GFRP、PMMA、PTFE,etc.