In electronics, we provide high-precision parts and conductivity-enhancing treatments. They encompass connectors, heat-dissipating modules, and sensor housings. Through plating and micro-machining processes, they meet industry conductivity norms, elevating performance in advanced electronic systems.
Applications
Component Name
Specific Application Scenarios
Heat Sinks
CPU/GPU coolers, heat dissipation fins for 5G base station power amplifiers.
Precision Connectors
High-speed data interfaces (HDMI, USB-C), RF connectors.
Semiconductor Packages
IC carriers, LED brackets, requiring precise pin alignment.
Optical Components
Camera lens mounts, LiDAR mirror bases, demanding zero deformation.
Common Materials
Metals
Aluminum alloys (6063, 6061)
copper alloys (C1100, C17200 beryllium copper)
Ceramics
Aluminum oxide (Al₂O₃)
aluminum nitride (AlN)
Engineering plastics
POM (polyoxymethylene)
LCP (liquid crystal polymer)
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